[Om-announce] 2023 IEEE WORLD CONGRESS ON SERVICES

[Huang Bing]

2023 IEEE WORLD CONGRESS ON SERVICES

CLOUD/EDGE/ICDH/ICWS/QSW/SSE

https://conferences.computer.org/services/2023

JULY 2-8, 2023, CHICAGO, ILLINOIS, USA

UPDATED Paper submissions due: March 25, 2023

UPDATED Final notifications to authors: May 8, 2023



The cash prizes will be provided for Best Papers and Best Student Papers
in addition to other cash awards of IEEE SERVICES 2023, please see IEEE SERVICES 2023 AWARDS:

https://conferences.computer.org/services/2023/awards/



****CALL FOR PAPERS****



The 2023 IEEE World Congress on Services (SERVICES) is the premier international forum for presenting and discussing the most recent and significant technical research contributions in the field of services computing. Centered around web-based services, SERVICES 2023 covers various systems and networking research pertaining to cloud, edge and Internet-of Things (IoT), as well as technologies for intelligent computing, learning, Big Data and blockchain applications, addressing critical issues such as knowledge network, high performance, security, privacy, dependability, trustworthiness, and cost-effectiveness.  Particularly, the 2023 Congress will welcome papers on the aftermath and the impact of COVID-19, as well as the Russia-Ukraine conflict, on services and the world infrastructure. In addition to co-located theme-topic conferences, the Congress will also include symposia and workshops supporting deep-dive discussions on emerging topics, and complement the SERVICES 2023 program with industry and application presentations and panels. Authors are invited to prepare early and submit original and unpublished papers to any of these conferences at www.easychair.org. All submitted manuscripts will be peer-reviewed by at least three reviewers. Accepted and presented papers will appear in the conference proceedings published by the IEEE Computer Society Press. IEEE SERVICES 2023 is the only premier professional event for the services computing field offered by IEEE, under the auspice of the Technical Committee on Services Computing (TCSVC).



****CLOUD: IEEE INTERNATIONAL CONFERENCE ON CLOUD COMPUTING****

The flagship theme-topic conference for modeling, developing, publishing, monitoring, managing, delivering Everything-as-a-Service (XaaS) in the context of various types of cloud environments.



****EDGE: IEEE INTERNATIONAL CONFERENCE ON EDGE COMPUTING****

The prime international forum for both researchers and industry practitioners to exchange the latest fundamental advances in state of the art and practice of edge computing, identify emerging research topics, and define the future of edge computing.



****ICDH: IEEE INTERNATIONAL CONFERENCE ON DIGITAL HEALTH****

The prime international forum for both researchers and industry practitioners to exchange the latest fundamental advances in the state of the art and practice of digital health technologies, emerging research topics, and the future of digital health.



****ICWS: IEEE INTERNATIONAL CONFERENCE ON WEB SERVICES****

The flagship theme-topic conference for Web-based services, featuring services modeling, development, publishing, discovery, recommendation, composition, testing, adaptation, and delivery, and Web services applications and standards.



****QSW: IEEE INTERNATIONAL CONFERENCE ON QUANTUM SOFTWARE****

The prime international conference for quantum software engineering, including hybrid quantum software, quantum software development, quantum in the cloud, quantum applications and services, and quantum software analysis and evolution.



****SSE: IEEE INTERNATIONAL CONFERENCE ON SOFTWARE SERVICES ENGINEERING****

The flagship theme-topic conference for software services engineering. It is the continuation of the former IEEE International Conference on Services Computing (SCC), with a deepened focus on software services engineering, from software design to software development and deployment. SSE also focuses on verification techniques testing and monitoring services behavior along their entire life cycle.



****MANUSCRIPT GUIDELINES AND SUBMISSION INFORMATION****

Paper size and format: US Letter; Two-column format in the IEEE style

Please download the paper template in WORD, LaTeX or Overleaf at https://www.ieee.org/conferences/publishing/templates.html


________________________________

CONFIDENTIALITY: This email is intended solely for the person(s) named and may be confidential and/or privileged. If you are not the intended recipient, please delete it, notify us and do not copy, use, or disclose its contents.
Towards a sustainable earth: Print only when necessary. Thank you.
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://mailman.openmath.org/pipermail/om-announce/attachments/20230306/a713a574/attachment-0001.htm>