[Om-announce] CFP IEEE COINS 2025 - IEEE International Conference on Omni-layer Intelligent Systems - University of Wisconsin–Madison, USA | August 4-6, 2025

[Nicola Dall'Ora]

===========================================

We apologize if you receive multiple copies of this CFPs.

===========================================

                  CALL FOR PAPERS

IEEE International Conference on Omni-layer Intelligent Systems

   University of Wisconsin–Madison, USA | August 4-6, 2025

                   https://eur02.safelinks.protection.outlook.com/?url=https%3A%2F%2Fcoinsconf.com%2F&data=05%7C02%7Com-announce%40openmath.org%7C48eadf5ff10246ce09e908dd0b004cd3%7Ccc7df24760ce4a0f9d75704cf60efc64%7C0%7C0%7C638678818127921502%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C0%7C%7C%7C&sdata=gimYArH%2FP70EjJHRj%2FChZt7UBBzKzus9yXkllvhRnqY%3D&reserved=0



Important Dates:

Abstract submission: 1 April 2025

Full paper submission: 8 April 2025

Special session, workshop, tutorial proposal submission: 8 April 2025

Acceptance notification: 31 May 2025

Camera-ready submission: 21 June 2025





Are you interested in taking part in shaping and adding new dimensions to the future IoT and AI ecosystem? Do you want to stay ahead and learn about the most prominent digital technologies that are radically shifting the paradigm? Or are you just curious about what IoT, AI, and Big Data are all about and how they impact every aspect of our lives, society, and business?
IEEE COINS (https://eur02.safelinks.protection.outlook.com/?url=https%3A%2F%2Fcoinsconf.com%2F&data=05%7C02%7Com-announce%40openmath.org%7C48eadf5ff10246ce09e908dd0b004cd3%7Ccc7df24760ce4a0f9d75704cf60efc64%7C0%7C0%7C638678818127921502%7CUnknown%7CTWFpbGZsb3d8eyJFbXB0eU1hcGkiOnRydWUsIlYiOiIwLjAuMDAwMCIsIlAiOiJXaW4zMiIsIkFOIjoiTWFpbCIsIldUIjoyfQ%3D%3D%7C0%7C%7C%7C&sdata=gimYArH%2FP70EjJHRj%2FChZt7UBBzKzus9yXkllvhRnqY%3D&reserved=0) is the right place to be. IEEE COINS brings together experts in Digital Transformation (from AI and IoT to Cloud, low power design, security, privacy, and robotics) from around the globe.



IEEE COINS includes a multi-disciplinary program, from technical research papers to panels, workshops, and tutorials on the latest technology developments and innovations. IEEE COINS will address all important aspects of the of the IoT/AI ecosystem. IEEE COINS solicits papers and proposals accompanying submissions for presentations in the following topical and vertical tracks:



Topical Area Tracks

1. Internet of Things: From Edge to Cloud

2. Sensing Devices and Systems for AIoT

3. Circuits and Systems (CAS) Designs AIoT

4. Communications and Networking for AIoT

5. Artificial Intelligence, Machine Learning, and Cognitive Computing

6. Distributed Ledger Technologies and Blockchain

7. Low Power Design and Automation

8. Security and Privacy

9. Intelligent Robots and Systems

10. Embedded AI



Vertical Tracks

1. Smart Infrastructure

      - Smart City

      - Energy and Smart Grids

      - Smart Agriculture

      - Smart Mobility, Transportation, and Logistics

2. Industry 4.0 and Smart Manufacturing

3. Digital Healthcare and Well-being



Special Tracks

1. Emerging Technologies on Intelligent Systems

2. Generative AI: Systems, Architectures, and Applications



Panels

1. Diversity, Equity, and Inclusion

2. Industrial Talks

3. Workshops/Tutorials



Organizing Committee

General Co-Chairs

Umit Yusuf Ogras, University of Wisconsin-Madison

Amit Singh, University of Essex



Technical Program Co-Chairs

Fatemeh Afghah, Clemson University

Priya Panda, Yale University



Publicity Chair Co-Chair

Aly Sabri Abdalla, Mississippi State University

Nicola Dall'Ora, University of Verona, Italy

Jaeha Kung, Korea University

Sumit K Mandal, IISC Bangalore

Oktay Cetinkaya, Univ. of New Castle
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <http://mailman.openmath.org/pipermail/om-announce/attachments/20241122/3571fd98/attachment-0001.htm>