[Om-announce] CFP: International Workshop Embedded Systems and Communications Security

iwoungan at scs.ryerson.ca iwoungan at scs.ryerson.ca
Mon Jun 8 15:06:33 CEST 2009

Call for Papers
International Workshop Embedded Systems and Communications Security
Held in conjunction with IEEE SRDS 2009, Niagara Falls, New York, U.S.A.,
September 27, 2009

The strong growth in mobile devices, networked embedded systems, wireless
sensors, in/inter-vehicular computing applications, the ever increasing
information computing power offered by computing clusters and information
services over networks (stationary and mobile) presents new challenges,
especially with respect to the security of integrated applications and
environments. Security solutions need to address cost, resource
constraints, potentially unreliable mobile systems with low-bandwidth
communication and physical constraints often found in embedded applications.

We solicit previously unpublished papers offering novel research
contributions in these aspects of computer security that focus on network
computing and mobile/ubiquitous systems. Papers may present advances in
the theory, design, implementation, analysis, or empirical evaluation of
secure systems, infrastructure, architectures, algorithms and protocols.
Topics include, but are not limited to:
 *  Embedded System and hardware Security/Trust
 *  Intrusion detection and prevention
 *  Security issues in Cluster/Grid computing
 *  Security for transport systems (cars, rail, aerospace, etc.)
 *  Methods for Key Management and Access Control
 *  Robust Secure Protocols and Cryptographic Methods
 *  Cryptanalysis Methods
 *  Power/Timing based attacks and mitigation
 *  Design for security
 *  Tamper resistance


To submit your paper, please consult the SRDS 2009 submission instructions
at: http://www.cse.buffalo.edu/srds2009/submission.html

* Submission due: July 6, 2009
* Decision due: August 10, 2009
* Camera-ready due: August 31, 2009
* Workshop date: September 27, 2009

All accepted papers will be included in a Workshop Proceedings distributed
at the time of the Workshop.

Workshop Chair:
Vinodh Gopal, Intel Corporation, USA

TPC Members:
 1. Dr. Michael Kurdziel, Harris Corp, USA
 2. Dr. Miroslav Velev, Aries Design Automation, USA
 3. Prof Ramalingam Sridhar, SUNY-Buffalo, USA
 4. Prof Philip Koopman, Carnegie-Mellon University, USA
 5. Prof Berk Sunar, Worcester Polytechnic Institute, USA
 6. Prof Cetin Kaya Koc, University of California, Santa Barbara, USA
 7. Divya Arora, Intel Corporation, USA
 8. Nachiketh Potlapally, Intel Corporation, USA

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